A novel electroless Ni Plating bath using Ti (III) ions as reluctant was proposed. In an industrial application of this plating bath, stability of the plating bath and plating rate are particularly important. Effects of plating bath components on Ni deposition rate onto Urethane foam or copper sheet were investigated, elucidating that Ni (II) ions, nitrilotriacetic acid and ammonium hydroxide concentration were important factors to control Ni deposition rate. Purity of Ni film reduced with Ti (III) ions was very high exceeding 99.9%.
