SPring-8/SACLA Research Report
Online ISSN : 2187-6886
Section B
In-situ Residual Stress Analysis in Resins for Semiconductor Packaging during Curing Process with 2D Detector, Part 2
Midori Wakabayashi, Atsushi Izumi, Takeshi Kakara, Dai Nagashima
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Keywords: 2015B1899, BL19B2
JOURNAL OPEN ACCESS

2017 Volume 5 Issue 1 Pages 141-144

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[in Japanese]
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