球状溶融シリカの TEOS 処理による付着性の変化

抄録

Spherical fused silica produced by flame fusion process has been used as a filler for epoxy molding compound to encapsulate electronic devices such as IC and semiconductors. By FE-SEM and TEM observation, a lot of silica nanoparticles adhere to the surface of spherical fused silica of several μm in diameter. The effect of surface treatment by using TEOS (tetra-ethyl-ortho- silicate) on the particle adhesive force was investigated by AFM and conventional tensile strength of powder bed. It was confirmed that particle adhesive force decreased after TEOS treatment by using both testing methods, and the specific surface area increased by the surface treatment. The relationship between the change of adhesion force after surface treatment with different condition and surface nanometer and molecular scaled structure of spherical fused silica was discussed. The decrease of adhesion force and increase of specific surface area of spherical fused silica after surface treatment were developed on the amount of residual functional etoxy group.