Preparation of Nitride Phosphor Particle Dispersed h-BN/Glass Composites

Abstract

Wavelength conversion materials with high thermal conductivity and heat resistance have been strongly desired for high power semiconductor lighting source. Glass has higher heat resistances at elevated temperatures than resin and dispersion of high thermal conductive particles should result in the improvement of thermal conductivity of the composites. In this study, the composites of phosphate glass dispersing nitride phosphor and high thermal conductive particles were fabricated instead of typical composites of resins and oxide phosphors. As a result of verification of reactivity of the nitride phosphor and the high thermal conductive particles with the phosphate glass, between the glass and fillers, the firing temperature was set to 500°C and h-BN particles were selected as high thermal conductive particles. Dense nitride phosphor particles dispersed h-BN/glass composites were successfully obtained by hot-pressing. Thermal conductivity normal to hot-pressing direction was higher than that parallel to hot-pressing direction, and it increased with an increase in the hot-pressing pressure and the quantity of dispersed h-BN particles because of higher density and better orientation of the h-BN particles. Consequently, the nitride phosphor particle dispersed h-BN/glass composites with the thermal conductivity of 9.4 W/(m⁻¹·K⁻¹) were obtained.