IEICE Transactions on Communications
Online ISSN : 1745-1345
Print ISSN : 0916-8516
Special Section on Recent Progress in Antennas, Propagation and Wireless Systems Related to Topics in ISAP2014
A 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and Differentially Fed through a Hole in a Silicon Chip
Naoya OIKAWAJiro HIROKAWAHiroshi NAKANOYasutake HIRACHIHiroshi ISONOAtsushi ISHIIMakoto ANDO
Author information
JOURNAL RESTRICTED ACCESS

2016 Volume E99.B Issue 1 Pages 27-32

Details
Abstract

For the realization of a high-efficiency antenna for 60GHz-band wireless personal area network, we propose placing a CMOS RF circuit and an antenna on opposing sides of a silicon chip. They are connected with low loss by a coaxial-line structure using a hole opening in the chip. Since the CMOS circuit is driven differentially, a differential-feed antenna is used. In this paper, we design and measure a differential-feed square patch antenna on a silicon chip. To enhance the radiation efficiency, it is placed on a 200µm thick resin layer. The calculated radiation efficiency of 79% includes the connection loss. A prototype antenna is measured in a reverberation chamber, and its radiation efficiency is estimated to be about 81±3%.

Content from these authors
© 2016 The Institute of Electronics, Information and Communication Engineers
Previous article Next article
feedback
Top