IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524
Special Section on Fundamentals and Applications of Advanced Semiconductor Devices
Strain Effects in van der Pauw (VDP) Stress Sensor Fabricated on (111) Silicon
Chun-Hyung CHOGinkyu CHOIHo-Young CHA
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2010 年 E93.C 巻 5 号 p. 640-643

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We have fabricated VDP (van der Pauw) stress sensors on (111) silicon surfaces. This work focuses on a study of strain effects in VDP stress sensors, which were generally ignored in previous works, for the precise measurements of die stresses in electronic packages. The stress sensitivity was observed to be approximately 10% larger for p-type VDP sensors compared to n-type VDP sensors.
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© 2010 The Institute of Electronics, Information and Communication Engineers
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