抄録
This paper presents the electrical contact behaviors of Au-plated material at super low making and breaking velocity conditions by introducing our new designed test rig. The fundamental phenomena in the contact voltage and contact force versus piezoactuator displacement curves were investigated under the load current of 1A and velocity of 50 nm/s. From the repetitive experimental results, we found that the adhesion phenomena during the unloading process are closely correlative with the initial contact stage in the loading process. Furthermore, a mathematical model which is relative to the variation of contact force in loading is built, thus the physical mechanism of adhesion and principal factors of gold-plated materials are discussed. Finally, the physical process of molten bridge under the no mechanical contact situation is also analyzed in detail.
