IEICE Transactions on Information and Systems
Online ISSN : 1745-1361
Print ISSN : 0916-8532
Special Section on Data Engineering and Information Management
Action Recognition Using Pose Data in a Distributed Environment over the Edge and Cloud
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2021 Volume E104.D Issue 5 Pages 539-550


With the development of cameras and sensors and the spread of cloud computing, life logs can be easily acquired and stored in general households for the various services that utilize the logs. However, it is difficult to analyze moving images that are acquired by home sensors in real time using machine learning because the data size is too large and the computational complexity is too high. Moreover, collecting and accumulating in the cloud moving images that are captured at home and can be used to identify individuals may invade the privacy of application users. We propose a method of distributed processing over the edge and cloud that addresses the processing latency and the privacy concerns. On the edge (sensor) side, we extract feature vectors of human key points from moving images using OpenPose, which is a pose estimation library. On the cloud side, we recognize actions by machine learning using only the feature vectors. In this study, we compare the action recognition accuracies of multiple machine learning methods. In addition, we measure the analysis processing time at the sensor and the cloud to investigate the feasibility of recognizing actions in real time. Then, we evaluate the proposed system by comparing it with the 3D ResNet model in recognition experiments. The experimental results demonstrate that the action recognition accuracy is the highest when using LSTM and that the introduction of dropout in action recognition using 100 categories alleviates overfitting because the models can learn more generic human actions by increasing the variety of actions. In addition, it is demonstrated that preprocessing using OpenPose on the sensor side can substantially reduce the transfer quantity from the sensor to the cloud.

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© 2021 The Institute of Electronics, Information and Communication Engineers
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