2019 年 64 巻 12 号 p. 705-711
In the field of the semiconductor manufacturing, the density and miniaturization of integrated circuits are progressing, and the process/design rule extends to several nanometers. It also means that Moore's law will come to an end in near future. Under such circumstances, stacking of the semiconductor integrated circuit in the thickness direction, stacking of metal wiring for speeding up, and thinning of the integrated circuit chip have become important. In this report, an outline of the silicon semiconductor manufacturing process, which is becoming more and more highly integrated is introduced, and at the same time, some explanations related to the tribology are also added.
