抄録
To clarify the mechanism of drying behavior of droplet remained on a silicon wafer in Marangoni drying used for rinsing and drying process in semiconductor manufacturing industries, the drying time of the droplet during organic gas dissolution have been investigated by using a CCD camera. And the concentration of organic component in the droplet has been measured with a micro-optical concentration sensor. In addition, numerical method that evaluating the drying time and the concentration is derived from phase equilibrium has been analyzed. There are qualitatively in good agreement. Finally, to get a guide line for decreasing watermark, organic and water concentration of atmosphere gas required have been proposed by using the numerical analysis.
