粉体材料のスパッタリングによる各種機能性薄膜の作製

抄録

Mechanism of the functional thin film fabrication method using powders target has been studied. Experimental results suggest that functional thin film can be fabricated, and it is possible to fabricate elementally controlled thin films. The reaction at the substrate surface with the plasma near the substrate is almost the same as in the normal sputtering deposition process. However, it was clarified that the reaction at the interface between the target surface and the plasma has different characteristics from the usual sputtering deposition mechanism. For example, it was suggested that the deposition rate, etc., near the target differs due to the different surface structure of the ion incident area.