抄録
This paper intended to describe a simplified optical method based on photoviscoelasticity proposed for measuring the residual stress in two-dimensional thermosetting resin molding generated by cooling. The fundamental equation for calculating the residual stress from the residual birefringence and deformation in two-dimensional photoviscoelastic body by cooling was derived using the linear photoviscoelastic theory. The practical analyses were carried out on three characteristic problems, which are the analyses of the residual stresses in a strip, plate and disk made of epoxy resin by rapid cooling. These residual stresses were measured by two methods i. e., the proposed simplified optical method and the well-known layer removal method. The effectiveness of the simplified optical method could be assessed by discussing and comparing the results obtained by the two methods.
