HYBRIDS

HYBRIDS

Published by The Japan Institute of Electronics Packaging

228 registered articles
(updated on March 05, 2026)

Online ISSN : 1884-1171
Print ISSN : 0914-2568
ISSN-L : 0914-2568

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1992 Volume 8 Issue 6

Solderless Chip Packaging Technology Using Anisotropic Conductive Adhesive Yasuo Iguchi, Masao Ikehata, Wataru Takahashi, Takashi Kanamori
Bare-Chip Face-down Bonding Technology Using Conductive Particles and Light-Setting Adhesives : “Elastic” Method Keiji Yamamura, Hiroshi Matsubara, Takashi Nukii
Fine Conection Technology Using Anisotropic Conductive Film Hisashi Andoh, Yukio Yamada, Yoko Fukuda
[title in Japanese]

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1

Multilayer Interconnect Board Based on Polymer Dielectric from Benzocyclobutene Resin

Released on J-STAGE: March 18, 2010 | Volume 7 Issue 1 Pages 23-28

Tadashi Takahashi
1

[title in Japanese]

Released on J-STAGE: March 18, 2010 | Volume 2 Issue 1 Pages 13-16

Kenji Takahashi, Masamichi Shindo
3

Wettability of Solder

Released on J-STAGE: March 18, 2010 | Volume 8 Issue 2 Pages 21-27

Nobuhiro Sasaki
4

Viscosity and Tackiness Measurement of Soder Paste

Released on J-STAGE: March 18, 2010 | Volume 8 Issue 2 Pages 14-20

Manabu Harada
5

Glass Ceramics

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 1 Pages 39-44

Masakazu Umetsu

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Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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