The miniscale throwing power of Cu (II) -EDTA complex plating baths containing potassium chloride, glycine and formaldehyde as additives, and the mechanical properties of the films obtained were investigated. The films obtained were shown to have nearly the same elongation and ultimate tensile strength as commercial high ductile electrolytic copper foil after heat-treatment for 1h at 160°C. The bath was shown to have an exellent miniscale throwing power for the production of PWB with minute holes. The miniscale throwing power is dominated with κ (∂η/∂i) _s/ (l²/2d), where κ is the conductivity of electrolyte, (∂η/∂i) _s is the polarization resistance at the board surface, l is the board thickness and d is the diameter of through-hole. Since the ∂η/∂i of above bath is high, good miniscale throwing index T_x (the ratio of thickness at the center of through-hole to that on the board surface), for example T_x=0.7 for PWB with l=2mm, d=0.l4mm at the current density of 2A/dm², may be predicted.

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Techniques for simulating switching noise on power distribution lines of printed wiring boards are described. The switching noise caused by active IC is assumed to be a noise source, and noise voltage generated on the power distribution line is calculated using noise estimation system (NESSY) . The power distribution lines are expressed by equivalent RLC networks. The noise source of ICs is assumed to be the combination of a noise source voltage and impedance. This noise source is connected to the equivalent networks of the power distribution lines, and the switching noise is simulated. Simulated switching noise was in good agreement with that measured. The proposed method is useful for the switching noise simulation of logic circuits.

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[in Japanese]

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