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Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
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Volume 13 (2024)
Issue 2 Pages 75-
Issue 1 Pages 31-
Volume 12 (2023)
Issue 6 Pages 306-
Issue 5 Pages 238-
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Volume 11 (2022)
Issue 6 Pages 272-
Issue 5 Pages 182-
Issue 4 Pages 148-
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Volume 10 (2021)
Issue 6 Pages 328-
Issue 5 Pages 286-
Issue 4 Pages 131-
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Issue 2 Pages 46-
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Volume 9 (2020)
Issue 6 Pages 250-
Issue 5 Pages 210-
Issue 4 Pages 158-
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Issue 2 Pages 41-
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Volume 8 (2019)
Issue 6 Pages 230-
Issue 5 Pages 162-
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Volume 7 (2018)
Issue 6 Pages 216-
Issue 5 Pages 172-
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Volume 6 (2017)
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Volume 5 (2016)
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Volume 4 (2015)
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Volume 3 (2014)
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Volume 2 (2013)
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Volume 1 (2012)
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Volume 7, Issue 1
Displaying 1-5 of 5 articles from this issue
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To Diagnose Complex Electromagnetic-Thermal-Fluid Phenomena of Arc Welding
Masaya SHIGETA, Manabu TANAKA
Article type: Review Article
2018 Volume 7 Issue 1 Pages 3-7
Published: 2018
Released on J-STAGE: January 05, 2019
DOI
https://doi.org/10.7791/jspmee.7.3
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(817K)
High Accurate Evaluation of Weld Solidification Cracking Susceptibility by In-situ Observation Technique
Kota KADOI
Article type: Review Article
2018 Volume 7 Issue 1 Pages 8-13
Published: 2018
Released on J-STAGE: January 05, 2019
DOI
https://doi.org/10.7791/jspmee.7.8
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(771K)
Development of Computing Methods for Analysis of Joining-Induced Thermal Conduction, Residual Stress and Deformation in Thin Plates
Ninshu MA, Hisashi SERIZAWA
Article type: Review Article
2018 Volume 7 Issue 1 Pages 14-20
Published: 2018
Released on J-STAGE: January 05, 2019
DOI
https://doi.org/10.7791/jspmee.7.14
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(914K)
Numerical Analyses of Charpy Impact Test for Welded Joints
Yasuhito TAKASHIMA, Fumiyoshi MINAMI
Article type: Review Article
2018 Volume 7 Issue 1 Pages 21-27
Published: 2018
Released on J-STAGE: January 05, 2019
DOI
https://doi.org/10.7791/jspmee.7.21
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(784K)
Lead-Free High Temperature Bonding Processes for Next Generation Power Module Packaging
Min-Su KIM, Hiroshi NISHIKAWA
Article type: Review Article
2018 Volume 7 Issue 1 Pages 28-31
Published: 2018
Released on J-STAGE: January 05, 2019
DOI
https://doi.org/10.7791/jspmee.7.28
JOURNAL
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(626K)
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