Thermal Science and Engineering
Online ISSN : 1882-2592
Print ISSN : 0918-9963
ISSN-L : 0918-9963
Volume 14 , Issue 1
Showing 1-2 articles out of 2 articles from the selected issue
  • Sang-chul BAE, Masafumi KATSUTA
    2006 Volume 14 Issue 1 Pages 1-8
    Published: 2006
    Released: October 26, 2007
    JOURNALS FREE ACCESS
    Our final goal of this study is to develop the heat driven type compact metal hydride (MH) refrigeration system for the vending machine and the show case, and to attain a refrigeration temperature of 243 K by using a heat source of about 423K. The reaction rate of the MH to use for the heat source, MH used for heat source is studied firstly because the MH refrigeration system consists of two MHs, one is used for the heat source and the other is used for the cooling load extracting. As for the reaction rate in the hydriding process, initially, a rapid surface reaction, governed by the relation 1-(1-F )1/3=kht . After the MH surface has been covered by hydride, the reaction becomes diffusion controlled with the relation 1-3(1-F ' )2/3+2(1-F ' )=k'ht . The reaction rates, kh and k'h , are exponentially proportional to the pressure difference and increase with temperature. And, as for the dehydriding process, it is found out that the rate-controlling step is uniquely diffusion reaction. The dehydriding reaction rate is exponentially proportional to the pressure difference and the initial reacted fraction, and increases with temperature. Finally, on the basis of these experimental results, the brand new rate correlations are reasonably derived. The predicted results for this correlation are in successfully agreement with the experimental ones.
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  • Kosei TANAHASHI
    2006 Volume 14 Issue 1 Pages 9-18
    Published: 2006
    Released: October 26, 2007
    JOURNALS FREE ACCESS
    The CPU power consumption in Notebook PCs is increasing every year. Video chips and HDDs are also continually using larger power for higher performance. In addition, since miniaturization is desired, the mounting of components is becoming more and more dense. Accordingly, the cooling mechanisms are increasingly important. The cooling modules have to dissipate larger amounts of heat in the same environmental conditions. Therefore, high capacity cooling capabilities is needed, while low costs and high reliability must be retained.
    Available cooling methods include air or water cooling systems and the heat conduction method. The air cooling system is to transmit heat by a cooling fan often using a heat pipe. The water cooling one employs the water to carry heat to the back of the display, which offers a comparatively large cooling area. The heat conduction method is to transfer the heat by thermal conduction to the case.
    This article describes the development of new and comparatively efficient cooling devices offering low cost and high reliability for air cooling system. As one of the development techniques, the heat resistance and performance are measured for various parts and layouts. Each cooling system is evaluated in the same measurement environment. With regards to the fans, an optimal shape of the fan blades to maximize air flow is found by using CFD simulation, and prototypes were built and tested.
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