In recent years, the heat generation density of devices has dramatically improved due to the miniaturization and high performance of electronic devices and the high temperature operation of power semiconductor devices, and a compact and high-performance air-cooled heat sink is required. We investigated the heat transfer characteristics of a plane heat sink using lotus type porous metal fins with many linear pores, arranged in a plane to reduce pressure loss. We established a thermal design method for this heat sink to predict heat transfer performance when the fin thickness and the number of fin stages were changed, and compared it with the actual measurement. As a result of comparing the heat transfer performance of the conventional groove type heat sink and the microchannel heat sink with the plane lotus heat sink, it became clear that the plane lotus heat sink has better heat transfer performance per heat sink volume.

View full abstract