Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a copper protector with higher heat conductivity produced a better gold deposit than using the ceramic plate.

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近年，演算処理の飛躍的な性能の向上により3Dグラフィックがより身近なものになっている．仮想世界を用いたSNSサイト，WiiやPlayStationの商用ゲームなどがその例である．仮想の世界を画面に描画するためには，仮想カメラを用いる．一般に画像を生成する時の仮想カメラの視野領域と，その画面を観察する時の視野領域は一致しない．近年，画面サイズが大きくなり画面を観察する視野領域が広がる傾向にある．そこで本稿では，視野領域が仮想空間の認識にどのような影響を及ぼすのか迷路を用いて実験を行った．その結果，視野領域が狭い状況でも被験者と画面との距離がある場合，空間認識にある程度の向上が見られた．

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我々は, 毒性の高いシアン化物イオンを含まないノーシアン無電解金めっき液を使用して, 各種金属基板 (ニッケルめっき済みのNi-Fe合金, 黄銅, 銅基板) にレーザ照射無電解金めっきを行った。このめっき液は, シアン化物イオンに代わる金属源として塩化金酸, 還元剤に次亜リン酸ナトリウム, 錯形成剤にコハク酸イミド, チオシアン酸カリウムなどを用いる弱アルカリ性のめっき液である。レーザめっきにおいて被めっき物である基板の熱伝導率は重要であり, 同一レーザ出力, 照射時間で用いた基板のうち, 熱伝導率が最も小さいNi-Fe合金基板上で得られる金めっき物の高さが最大であった。これらめっき物の高さや直径は, レーザ出力や照射時間あるいはめっき液の循環速度によって制御できることがわかった。

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We studied how polyimide substrate etching and argon laser irradiation conditions affected the deposition of nickel line patterns. Polyimide substrates were etched in NaOH solutions at room temperature, followed by measurement of contact angles, AFM diagrams, and FT-IR spectra to determine optimum NaOH concentration and etching duration ensuring good deposition. After etching at concentrations exceeding 10wt% and at durations exceeding 30s, the etched substrate surface consisted of polar molecules and had a low contact angle, resulting in good nickel pattern deposition. Excess etching caused macroscopic roughening of the substrate surface. Although a certain degree of laser power density was needed to ensure deposition, too high a power caused plating solution to boil and substrates to be thermally damaged. When laser beam was scanned at more than 50μm/s, no deposition was obtained because substrates were not heated enough. Optimum deposition was at 300-800W/cm² and scanning slower than 25μm/s for a substrate 50μm thick and a beam diameter of 100μm. Nickel lines about 100μm wide and 0.3-0.4μm thick were obtained, although their width increased with increasing power density.

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Laser-enhanced electroless plating has been a forcus of interest as a maskless selective plating technique. This study was designed to elucidate the optimum conditions under which a uniform electroless nickel film could be obtained under irradiation by an argon ion laser. Highly selective metal spots were observed in the region of laser irradiation on polyimide film activated by palladium.
The amount of deposits was roughly proportional to irradiation time, and the deposition rate was approximately 4 times higher than in conventional electroless nickel plating. Electroless nickel plating without the activation process was possible selectively at the site of laser irradiation, but the films deposited were not uniform.
The deposition rate during laser beam irradiation depended on the pH of the plating solution, as in conventional electroless nickel plating. Using unactivated substrates, virtually no deposits were observed when pH was less than 5.
Generally the plating spots were of the same size as the laser beam, but when laser power was reduced, the plating spots were smaller than the diameter of beam.
Laser irradiation also had an influence on deposit structure. Laser-enhanced electroless deposits showed several sharp X-ray peaks caused by crystalline nickel differing from the broad pattern associated with the amorphous structure. This seemed to be related to the reduction of the phosphorus content in the deposits as a result of laser irradiation.

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