抄録
Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a copper protector with higher heat conductivity produced a better gold deposit than using the ceramic plate.
