論文
カーボンオニオンのナノ砥粒としての適用可能性に関する研究
2011 年 77 巻 3 号 p. 311-315
詳細
2011 年 77 巻 3 号 p. 311-315
The current research has investigated the applicability of carbon onions as a nano-abrasive. Carbon onions were prepared from nano-diamond particles by annealing with an induction heating furnace, and silicon wafers were polished with carbon onions. The surfaces polished with carbon onions and non-annealed nano-diamonds were compared using an atomic force microscope in terms of the number of scratches and the surface roughness. The surface roughness of the wafer polished with non-annealed nano-diamonds was 0.59 nmRy and numerous scratches were formed on the surface. On the other hand, the surface roughness of the wafer polished with carbon onions was 0.38 nmRy and few scratches were observed on the surface. This reveals that the abrasive performance of carbon onions would be superior to that of non-annealed nano-diamonds.
