光造形法による成形に用いられるエポキシ樹脂配合

―カチオン/ ラジカル硬化・ハイブリッドシステムと相互侵入高分子網目―

抄録

This article reviews epoxy resin formulations used for the fabrication via Stereolithography（SL） method. The basic concept of the SL method utilizing photocurable resins was come up with first by a Japanese researcher, Hideo Kodama, who applied the Japanese patent in 1980. The following year, his invention was open to public in a US scientific journal “Review of Scientific Instruments”. Kodama’s patent application was performed several years earlier than the US patent of C.W. Hull known as a leading player in popularizing the SL method and 3D printing apparatuses worldwide. The epoxy resin system widely used for 3D printing is the epoxy/acrylate hybrid formulation which was first applied for patent by a Japanese company in 1988. The epoxy/acrylate simultaneous photo curing system is considered to build up Interpenetrating Polymer Network （IPN），so-called Simultaneous-IPN（SIN）．The photo curing SIN system has been examined by many researchers, and the curing mechanism is being gradually clear along with the advantages and disadvantages of the SIN system. Another IPN system, Sequential-IPN（SIPN），which is built up typically from the thermalcuring epoxy and the photo-curing acrylate components through two-stage curing, is under study to apply for 3D printing. The purpose of utilizing SIPN system is to improve mechanical properties of the 3D objects formed.