2016 年 1 巻 p. 87-92
An experimental-numerical hybrid method is proposed for obtaining reliable and accurate strains induced by temperature change. Strains obtained from measured displacement distributions are suffered from the measurement errors. Therefore, the measured displacements are used as the input data for determining boundary condition of a finite element model. Nodal forces by the temperature change at all nodes in the finite element model are identified from the measured displacements by the proposed method. Simultaneously, the reliable displacements and the strains are obtained. Effectiveness is validated by applying the proposed method to the displacement fields in dissimilar materials under thermal load obtained by digital image correlation. Results show that the nodal forces for a local finite element model can be obtained by the proposed method and subsequent strain analysis can be performed. It is expected that the proposed method can be powerful tool for stress and strain analysis of electronic devices under thermal load.
