Comparative study of the dentin bond strength of a new universal adhesive

抄録

This study compared the dentin bond strength of a new universal adhesive with that of contemporary multi-step dentin adhesives. Six experimental groups were prepared according to the adhesives used and their application modes: Optibond FL (OB), Adper Single Bond Plus (SB), One-Step Plus (OS), Clearfil SE Bond (CS), All-Bond Universal using etch-and-rinse mode (ABE), and AllBond Universal using self-etch mode (ABS). Micro-tensile bond strength (µTBS) and failure mode were evaluated for each group. The bonded interface was analyzed using transmission electron microscopy (TEM). As a result, µTBS of 6 experimental groups was followed as: OB=ABE=SE=ABS>SB>OS group. TEM micrographs of ABE and ABS groups revealed a homogenous adhesive layer formation. In conclusion, a new universal adhesive can make reliable bond to dentin, regardless of the application mode.