Analysis of residual stress in the resin of metal-resin adhesion structures by scanning acoustic microscopy

抄録

The residual stress caused by polymerization shrinkage and thermal contraction of a heat-curing resin containing 4-META on a metal-resin structure was measured by a scanning acoustic microscope. The tensile residual stress in the resin occurred within 70 µm of the adhesion interface with a flat plate specimen. The maximum tensile stress was about 58 MPa at the interface. On a metal plate specimen with retention holes, ring-like cracks in the resin occurred around the retention holes with the adhesive specimen and many linear cracks occurred in the resin vertical to the longitudinal direction of the metal frame with the non-adhesive specimens. There was tensile residual stress on the resin surface at the center of the retention holes of the adhesion specimen, indicating that the stress in the specimen with surface treatment for adhesion was higher than in that without surface treatment.