Dental Materials Journal
Online ISSN : 1881-1361
Print ISSN : 0287-4547
ISSN-L : 0287-4547
Influence of Primers Containing Cupric Ion on Bonding of Dentin Treated with Phosphoric Acid
Yohji IMAIRyuichiro IKEMURA
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JOURNAL FREE ACCESS

1994 Volume 13 Issue 1 Pages 66-75,126

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Abstract
A primer containing cupric [Cu (II)] ions that promoted the interfacial initiation of polymerization from dentin surfaces was studied. Bovine dentin surfaces were treated with 10% phosphoric acid, then with a Cu primer consisting of aqueous 35% 2-hydroxyethyl methacrylate (HEMA) containing 0.03% cupric salt, and finally bonded with 4-META/MMA-PMMA resin initiated with oxidized tributylborane (TBBO). The use of the Cu primer resulted in a mean bond strength of 12.5MPa compared with 3.8MPa without the primer and 6.3MPa using a 35% HEMA primer without Cu. The Cu primer produced a bond strength of 13.5MPa even without 4-META in the resin system. Use of the Cu primer should simplify the bonding procedure since enamel and dentin can be etched simultaneously with 10% phosphoric acid.
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© The Japanese Society for Dental Materials and Devices
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