Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-04
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Host: Japan Institute of Electronics Packaging

Consideration of Solder Joints Mechanism for Electroless Ni-P Plating Film
*yoshifumi kanetaka, Naomi Ishizuka, Toshiya Suzuki, Tomoo Murakami
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Keywords: Reliability of Solder Joints, Lead Free Solder Joints
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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