Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-05
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Host: Japan Institute of Electronics Packaging

Deformation evaluation of solder joint by electromotive force
*Tetsuo Kumazawa, Nobutaka Ito
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Keywords: Electromotive force, Deformation, Tension test, Solder jopint
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Abstract
Deformation of solder joints was evaluated by electromotive force that was generated due to strain energy. The solder joints of SnPb and SnAgCu were tested. Strain energy of shear fracture was smaller than that of pull fracture.
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© 2008 by The Japan Institute of Electronics Packaging
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