The 22th JIEP Annual Meeting
Session ID : 18B-06
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Host: Japan Institute of Electronics Packaging
Three-dimensional Observation of Thermal Fatigue Crack in Flip Chip Interconnects by Synchrotron Radiation X-ray Micro-tomography
*Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
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