Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18C-22
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Host: Japan Institute of Electronics Packaging

Measurement of Local Distribution of Residual Stress in 3-D Stacked Flip Chips
*Takuya Sasaki, Nobuki Ueta, Hideo Miura
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Keywords: flip chip bonding, piezoresistive effect
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Abstract
[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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