Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 19B-15
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Host: Japan Institute of Electronics Packaging

Influence of Deformation of Single Crystalline Copper on its Surface Activated Bonding at Room Temperature.
*Reona Takagishi, Masatake Akaike, Tadatomo Suga
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Keywords: Cu Single Crystal, Surface Activated Bonding, Room Temperature, Ultra High Vacuum
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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