Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 17C-04
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Host: Japan Institute of Electronics Packaging

Wafer Level MEMS Package
*Masanobu Saruta, Hideyuki Wada, Michikazu Tomita, Kohei Matsumaru, Tatsuo Suemasu, Hirokazu Hashimoto
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Keywords: Through Silicon Vias, Wafer Level, Package, MEMS
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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