3B12 基板上に設けられた凹凸周辺の液晶配向性

抄録

PI alignment layer around bumps is thicker than that at tile flat place. It causes a difference of transmittance at gray level. It is confirmed that alignment defects around the bumps shrunk in high pressing rubbing condition, and the area of defbcts depend on the rotation speed of rubbing roller. We think that the thickness of PI and the rubbing condition are key factors for alignment defecis around bumps.