IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
Dynamic thermal management for 3D multicore processors under process variations
Hyejeong HongJaeil LimHyunyul LimSungho Kang
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ジャーナル フリー

2013 年 10 巻 23 号 p. 20130800

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抄録
Stacking core layers is emerging as an alternative for future high performance computing, but thermal problems have to be tackled first. When adaptive voltage scaling is adopted to hide the growing variation in the performance of cores, as a result, heat generation of each core varies. By exploiting the static thermal characteristics, the efficiency of dynamic thermal management can be improved. The proposed thermal management reduces the energy consumption by up to 30.02% compared with existing techniques, while keeping the ratio of temperature violations around 1%.
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© 2013 by The Institute of Electronics, Information and Communication Engineers
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