IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
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Chip-to-chip interconnect integration technologies
Muneeb ZiaChaoqi ZhangHyun Suk YangLi ZhengMuhannad Bakir
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JOURNALS FREE ACCESS

2016 Volume 13 Issue 6 Pages 20162001

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Abstract

With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing high-bandwidth low-energy chip-to-chip communication.

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© 2016 by The Institute of Electronics, Information and Communication Engineers
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