LETTER
A single phase modulation for pulse-based inductive-coupling connection in 3D stacked chip
2017 年 14 巻 20 号 p. 20170874
詳細
2017 年 14 巻 20 号 p. 20170874
This paper proposes an efficient modulation in high-speed inter-chip data communication with inductive-coupling wireless connection for 3D-stacked system in package (SiP). In this modulation, signal is generated only in one polarity of the digital signal transmission. Compared with BPM and NRZ modulation, it has a 50% power reduction and better crosstalk immunity.
