IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
Edge plating for building large arrays and low-inductance board-to-board connection
Junho Park, Dong Gun Kam
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Keywords: edge plating, board-to-board connection, power distribution network (PDN), contiguous plane, low inductance
JOURNAL FREE ACCESS

2018 Volume 15 Issue 24 Pages 20180953

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Abstract

This paper proposed the use of edge plating for direct board-to-board connection. Edge plating offers a contiguous reference plane for array antenna applications and can significantly reduce the loop inductance of power distribution networks.

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© 2018 by The Institute of Electronics, Information and Communication Engineers
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