IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
An integrated packaging hybrid power supply modulator for transmitter systems
Xingli CuiXin QiuYongqing LengXiaotian LiuShiyu ZuoYongzhou LiAizhen HuBo Xu
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2024 年 21 巻 1 号 p. 20230502

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A method is proposed for a hybrid power supply modulator (PSM) which consists of a wideband linear amplifier (LA), switching converters (SC), and a hysteresis comparator (HC) for an envelope tracking transmitter. By a compensation method of using a dual feedback network, the stability of the LA circuit is realized. A System in Package (SiP) structure based on separated gallium nitride (GaN) devices and the designed LA is proposed to achieve high performance, high reliability, and miniaturization. Ranging from -40∼100°C of operating temperature, the 3dB bandwidth of the proposed PSM can reach over 120MHz which achieves the maximum efficiency of 82% at an average output power of over 4W with 2.5∼4.5V power supply. Using a long-term evolution (LTE) 10MHz quadrature phase shift keying (QPSK) with Peak to Average Power Ratio (PAPR) of 6.5dB at 225∼512MHz, the envelope tracking transmitter is measured that the power added efficiency (PAE) is 58.95∼66.96%, Error Vector Magnitude (EVM) is 1.7∼2.36%.

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© 2024 by The Institute of Electronics, Information and Communication Engineers
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