IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
A simple and effective fluidic encapsulation protocol for bioMEMS devices
Bashir I. MorshedMaitham ShamsTofy Mussivand
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JOURNALS FREE ACCESS

2011 Volume 8 Issue 19 Pages 1549-1555

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Abstract

Biomedical micro-electromechanical systems (bioMEMS) and other biochips usually have exposed chip surfaces that interface with fluids containing biological elements. These chips require post-processing for fluidic encapsulation to confine the spreading of fluids during experiments. An effective fluidic encapsulation protocol is reported here that simplifies this encapsulation procedure. The protocol uses tools and components found in a typical fabrication laboratory setting. The procedure encapsulates each edge of the chip working area in one cycle and achieves sharply defined edges with thickness of 1 to 5mm with boundary tolerance less than 1mm. The protocol reduces time, complexity, cost and defects for biochip encapsulation with a working area having lengths between 3 to 100mm.

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© 2011 by The Institute of Electronics, Information and Communication Engineers
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