論文ID: 15.20180502
Aging is an important concern in long term reliability of semiconductor devices. In this regard, Bias Temperature Instability (BTI) is considered the major aging mechanism in nanometer regime, particularly in FinFET devices. Therefore, a well understanding of BTI mechanism in FinFET technology is of high interest. In this paper, a three-dimensional TCAD analysis about the impact of negative BTI (NBTI) FinFET technology is presented. In addition, a new NBTI degradation model is proposed for FinFET devices that can be incorporated in Spice which allow to consider aging of a circuit in a design phase. The three-dimensional TCAD analysis is performed using Synopsys Sentaurus tool. Results from the proposed model agree with Sentaurus degradation results.
