IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543

This article has now been updated. Please use the final version.

An integrated packaging hybrid power supply modulator for transmitter systems
Xingli CuiXin QiuYongqing LengXiaotian LiuShiyu ZuoYongzhou LiAizhen HuBo Xu
Author information
JOURNAL FREE ACCESS Advance online publication

Article ID: 20.20230502

Details
Abstract

A method is proposed for a hybrid power supply modulator (PSM) which consists of a wideband linear amplifier (LA), switching converters (SC), and a hysteresis comparator (HC) for an envelope tracking transmitter. By a compensation method of using a dual feedback network, the stability of the LA circuit is realized. A System in Package (SiP) structure based on separated gallium nitride (GaN) devices and the designed LA is proposed to achieve high performance, high reliability, and miniaturization. Ranging from -40 ∼ 100℃ of operating temperature, the 3dB bandwidth of the proposed PSM can reach over 120MHz which achieves the maximum efficiency of 82% at an average output power of over 4W with 2.5 ∼ 4.5V power supply. Using a long-term evolution (LTE) 10MHz quadrature phase shift keying (QPSK) with Peak to Average Power Ratio (PAPR) of 6.5dB at 225 ∼ 512MHz, the envelope tracking transmitter is measured that the power added efficiency (PAE) is 58.95 ∼ 66.96%, Error Vector Magnitude (EVM) is 1.7 ∼ 2.36%.

Content from these authors
© 2023 by The Institute of Electronics, Information and Communication Engineers
feedback
Top