A Novel T-P&S Hybrid Thermal Management Structure for HPD-PCB and Experimental Investigation

Abstract

This paper proposes a new type of embedded thermal pipe and thermal sheet (T-P&S) combined high power density PCB thermal structure for the problems of poor thermal conductivity and uneven thermal resistance distribution of the traditional PCB structure. A special thick copper thermal layer is constructed inside the traditional PCB, and low impedance thermal paths are established between the heat generating layer and the heat dissipation layer through the upper and lower thick-walled thermal pipes to realize a good heat exchange. Among them, the thermal conductivity layer and the signal layer are insulated to avoid thermoelectric coupling, which affects the electrical characteristics of the device. And with the traditional PCB heat dissipation structure for comparative experimental study, the experimental results show that, in the same thermal power, the designed PCB structure compared to the traditional PCB device surface temperature reduced by 5 ℃, synchronous reduction of 11%. Through the long-term application of thermal power experiments, it is concluded that the proposed structure HPD-PCB (T-P&S) can effectively and improve the uniformity of thermal stress distribution and reduce the steady-state thermal temperature of high-power devices.