抄録
Analysis of hypophosphite (reducing agent), phoshite (the oxidation product of hypophosphite) and some organic acids (buffers and complexing agents) in electroless nickel plating baths used in fibers for electromagnetic wave shield was carried out within 10 minutes by isotachophoresis using hydrochloric acid and β-alanine buffer as the leading electrolyte.
Analysis formate (oxidation product of formaldehyde as a reducing agent), EDTA and tartaric acid (complexing agents), and Cu-EDTA (copper complex of EDTA) in electroless copper plating baths used in fibers for electromagnetic wave shield was carried out within 10 minutes by isotachophoresis using hydrochloric acid and histidine buffers as the leading electrolyte.
Several metals were simultaneously determined by isotachophoresis employing a solution of sodium acetate and tartaric acid as the leading electrolyte.
The plating speed and effective utility ratio of reducing agent, were caliculated the concentration of nickel, hypophosphite and phosphite in nickel plating bath obtained by this method.
The nickel/copper ratios in extracts from the deposit films into an aqueous solution of HNO3 obtained by isotachophoresis were almost equal to that found by atomic absorption spectrometry.
