2015 Volume 23 Pages 18-22
Thermal expansion causes problems in semiconductor industry and optical communications where precise positioning is required. There are a few materials that show negative thermal expansion (NTE). It was recently found that perovskite Bi1–xLaxNiO3 show giant NTE around room temperature. In this study, BiNi0.85Fe0.15O3 powders were prepared by high-pressure synthesis at 6 GPa and 1000°C and were dispersed in a epoxy resin as filler. TheCTE of BiNi0.85Fe0.15O3 reaches 187 ppm K–1 and it is demonstrated that 18 vol. % addition of the present compound compensates for the thermal expansion of epoxy resin.