電気学会論文誌C(電子・情報・システム部門誌)
Online ISSN : 1348-8155
Print ISSN : 0385-4221
ISSN-L : 0385-4221
<電子材料>
キャパシタ内蔵基板用材料とその応用検討
山本 和徳島田 靖島山 裕一平田 善毅神代 恭
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2006 年 126 巻 6 号 p. 696-701

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We have developed a new resin-coated-foil(RCF) material named MCF-HD-45 to be embedded in PWBs to constitute capacitors. The material is composed of a thermosetting resin and a high dielectric constant(Dk) filler. The filler has a multimodal size distribution to attain high loading; a specific surfactant is also essential to preserve the stability of filler dispersion in varnish. These technologies warrant MCF-HD-45 a high Dk of 45 and excellent reliability. This paper describes the test results of MCF-HD-45 applied to a power amplifier module, a low pass filter of cellular phones, and a decoupling capacitor for noise suppression, as well as the benefit of the database for high frequency circuit simulation.

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© 電気学会 2006
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