抄録
LIGA process has been developed in the 2.5-dimensional world. We introduced new technologies of a 3D X-ray lithography and a worm injection molding with an unscrewing demolding mechanism, and succeeded in the deployment of a three- dimensional LIGA process. Furthermore, it succeeded to fabricate a spiral microcoil using 3D-LIGA process and a metallization technique combined flat and smooth electroplating and isotropic chemical etching. A diameter of the microcoil was 0.5 mm and the length was 1 mm. The width of coil lines was 10 μm, and the pitch was 20 μm. Also the characteristics as an inductor of this microcoil is such that the inductance and the quality factor at the frequency of 1 GHz was 91 nH and 5.8, respectively.
