ミリ波複素誘電率高精度評価法を用いたFDM型3Dプリンタ製熱可塑性樹脂基板の基礎検討

抄録

The era of Internet of Things (IoT) utilizing a large number of wireless sensors is approaching. Such microwave and millimeter wave IoT devices are required not only to have high performance and reliability, but also to have a low cost, variety products and quick developments. Realization of the planer type circuits with an FDM type 3D printer is one of a solution to meet these requirements. In the FDM type, the internal structure of the printed product can be changed easily by printer settings. That mean the complex permittivity of a 3D printed substrate will be able to controlled arbitrarily by RF designer. In this paper, the printing conditions and the complex permittivity of a thin thermoplastic ABS resin substrate for the FDM type 3D printer are studied using the TE₀₁₁ mode cylindrical cavity resonator method in the 36 GHz band. It is clarified that the relative deviation of the complex permittivity is about 1.5%, and the effective complex permittivity is decreased by the surface unevenness caused by the FDM method. We expect the results can be useful to develop low cost and rapid realization of wireless devices with AM technology for next generation sustainable society.