電気学会論文誌C(電子・情報・システム部門誌)
Online ISSN : 1348-8155
Print ISSN : 0385-4221
ISSN-L : 0385-4221
BSCCO/Te半導体接合を用いた三端子素子の作製
黄 啓新吉川 信行菅原 昌敬
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1992 年 112 巻 11 号 p. 705-710

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In order to realize a superconductor/semiconductor three terminal devices such as SUBSIT, it is necessary to make a superconductor/semiconductor interface without Schottky behavior. We selected BSCCO superconductor and Te semiconductor as materials of the junction and conducted a basic experimental study concerning, (i) the electrical property of BSCCO/Te junction and, (ii) the characteristics of three terminal devices with the BSCCO/Te junction. It is found that the BSCCO/Te junction reveals small Schottky-barrier with the barrier height is about 17.5 meV at 10 K. In the three terminal devices composed of BSCCO, BSCO, Te and Au layers, the modulation of current-voltage characteristics of the BSCCO/Te junction is observed by current injection in the BSCCO/BSCO/BSCCO junction. The current gain coefficient is about 7.2×10-3 at 4.2K.

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