抄録
This paper investigates a new process for assembling micro components by bonding element using magnetic polarity and attraction. The components can be connected mechanically and electrically by these bonding elements without accurate component positioning. The new bonding elements which have a larger permanent magnet area with an electrode function have been developed. A new process for the bonding element using negative tone resist(SU-8) has also been developed. The linearity of the tapered angle was improved by adjusting the roughness of substrate ground. The bonding elements with taper shape of 160 μm in thickness and tapered angle of 15 degrees were fabricated and the mechanical and electrical performance was verified.
