Optimal Design and Dimensionless Correlation Development for Natural Convection Cooling Board

Abstract

This paper focuses on the many parameters of PCB (Printed Circuit Board) that might affect on heat flow in the PCB. The parameter study found some guidelines that contribute to provide effective cooling PCB structure, and the study also found that the PCB structure affects temperature distribution of the PCB. Such heat transfer brings up many factors, however dimensionless analysis is considered appropriate way to study this complex heat transfer. Non-dimensional correlation between Nusselt number (Nu) and Grashoff number (Gr), dedicated to high-density PCB, was derived in natural convection cooling system. For the verification of the correlation, experimental simulation was performed in basis of several PCB properties. And unique definitions were given to dimensionless numbers.