Abstract
We reported on a numerical analysis of the material properties that directly control the quality of the analytic results in our previous paper. In this paper, we focus on parameter optimization for the underfill in high density products such as consumer electronics devices. We report on our methodology to optimize the underfill properties through some parameter studies with numerical analysis.
It is difficult to select the best underfill to be used for the high density packaging. In this study, some currently available underfills and a newly developed one are used in wafer level chip-sized package technology to compare the reliability of the packages against the stress and strain caused at both solder and underfill under thermal stress.
